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Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.
Nickel electroforming has nickel plating applied for fabrication of nickel products. For example, nickel can be deposited onto a mandrel and then lifted off the latter, creating a nickel-only part. [8] Nickel is also used as an undercoat for chrome or gold plating, as it improves adhesion and the longevity of the final layer.
Decoration: Copper-Nickel-Chrome and their alloys, Trivalent Chrome; Plating On Plastics: Wetting Agents, Neutralizers, Activators, Electroless Nickel For Plastic Metallization; Precious metals: Complete range of pure metals and their alloys: Gold, Silver, Palladium, Rhodium, Platinum, Ruthenium (Nickel and Cadmium free options are available)
Gold Plating: This gives the coin a high-quality, prestigious look. Gold plating can range from bright to more subdued antique finishes. Silver Plating: Silver plating provides a sleek, modern appearance. Like gold, it can also be finished in a bright or antique style. Nickel Plating: Nickel plating is a popular choice for a shiny, mirror-like ...
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Nickel plating may refer to: Nickel electroplating , a technique of electroplating a thin layer of nickel onto a metal object Electroless nickel-phosphorus plating , an auto-catalytic chemical technique used to deposit a layer of nickel-phosphorus on a solid workpiece