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A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow oven). The thermal profile is often measured along a variety of dimensions such as slope, soak, time above liquidus (TAL), and peak. A thermal profile can be ranked on how it fits in a process ...
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Thermal simulations give engineers a visual representation of the temperature and airflow inside the equipment. Thermal simulations enable engineers to design the cooling system; to optimise a design to reduce power consumption, weight and cost; and to verify the thermal design to ensure there are no issues when the equipment is built.
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP ...
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The moment method was developed from the observation that the plot of the second derivative of the thermal profile for laminar flow over a plate looks very much like a Gaussian distribution curve. [9] It is straightforward to cast the properly scaled thermal profile into a suitable integral kernel. The thermal profile central moments are ...
The full-field monitoring capabilities of an image correlation technique allow for the measurement of strain magnitude and location on the surface of a specimen during a displacement-causing event, [10] such as PCBA during a thermal profile. These "strain maps" allow for the comparison of strain levels over full areas of interest.
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