Search results
Results from the WOW.Com Content Network
Polarity marking on a SMD-V-chip capacitor. SMD style electrolytic capacitors with non-solid electrolyte (vertical-chips, V-chips) have a colored filled half circle or a minus bar on the top case side visible to indicate the minus terminal side. Additionally, the insulating plate under the capacitor body uses two skewed edges to indicate that ...
Ceramic capacitors may experience changes to their electrical parameters due to soldering stress. The heat of the solder bath, especially for SMD styles, can cause changes of contact resistance between terminals and electrodes. For ferroelectric class 2 ceramic capacitors, the soldering temperature is above the Curie point. The polarized ...
The greatest stress factor is soldering. The heat of the solder bath, especially for SMD capacitors, can cause ceramic capacitors to change contact resistance between terminals and electrodes; in film capacitors, the film may shrink, and in wet electrolytic capacitors the electrolyte may boil.
Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. Ceramic column grid array (CCGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. The body of the ...
Trimming capacitors can be multi-plate parallel-plate capacitors with a dielectric for between plates for increased capacitance. However, at SHF only very small values of capacitance are needed. Presets at these frequencies are commonly a glass tube with plates at either end.
Tantalum capacitors in different styles: axial, radial and SMD-chip versions (size comparison with a match) 10 μF 30 VDC-rated tantalum capacitors, solid electrolyte epoxy-dipped style. A tantalum electrolytic capacitor is an electrolytic capacitor, a passive component of electronic circuits.
Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.
Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask ), creating a mechanical and electrical connection.