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Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints becomes more of a concern as less and less solder is allowed for each joint. Voiding is a fault commonly associated with solder joints, especially when reflowing a solder paste in the SMT application.
Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask ), creating a reliable mechanical and electrical connection.
Soldering guns are used where more heat is needed than from the lower-power soldering irons. They can be used for heavy electrical connections, stained glass assembly, and light sheet-metal work. Typical soldering guns are rated at 100 to 240 watts power. A gun may include a two-stage trigger to give two heat settings.
In electronics, rework (or re-work) is the repair or refinish of a printed circuit board (PCB) assembly, usually involving desoldering and re-soldering of surface-mounted electronic components (SMD).
Each solder alloy has characteristics that work best for certain applications, notably strength and conductivity, and each type of solder and alloy has different melting temperatures. The term silver solder denotes the type of solder that is used. Some soft solders are "silver-bearing" alloys used to solder silver-plated items.
Sensors installed to a fixture to check selective solder machine parameters Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes.
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