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  2. Flux (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Flux_(metallurgy)

    Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

  3. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]

  4. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Best solder for aluminium wire to Copper busses or copper wire to aluminium busses or contacts. [69] UNS#: L91090 Sn 85 Zn 15: 199: 260 [69] Yes: No: KappAloy15 Designed specifically for aluminium-to-aluminium and aluminium-to-copper soldering. It has good corrosion resistance and tensile strength.

  5. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    The electric soldering iron is widely used for hand-soldering, consisting of a heating element in contact with the "iron" (a larger mass of metal, usually copper) which is in contact with the working tip made of copper. Usually, soldering irons can be fitted with a variety of tips, ranging from blunt, to very fine, to chisel heads for hot ...

  6. Wave soldering - Wikipedia

    en.wikipedia.org/wiki/Wave_soldering

    Flux in the wave soldering process has a primary and a secondary objective. The primary objective is to clean the components that are to be soldered, principally any oxide layers that may have formed. [3] There are two types of flux, corrosive and noncorrosive. Noncorrosive flux requires precleaning and is used when low acidity is required.

  7. Thermal copper pillar bump - Wikipedia

    en.wikipedia.org/wiki/Thermal_copper_pillar_bump

    A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).

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