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Laser cutting. Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics.
Laser types with distinct laser lines are shown above the wavelength bar, while below are shown lasers that can emit in a wavelength range. The height of the lines and bars gives an indication of the maximal power/pulse energy commercially available, while the color codifies the type of laser material (see the figure description for details).
Laser metal deposition. (Redirected from Laser Metal Deposition) Laser metal deposition (LMD) is an additive manufacturing process in which a feedstock material (typically a powder) is melted with a laser and then deposited onto a substrate. [1] A variety of pure metals and alloys can be used as the feedstock, as well as composite materials ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
where t is the depth of cut, P is the laser beam power, v is the cutting velocity, and d is the laser beam spot diameter. [5] The depth of the cut is also influenced by the workpiece material. The material's reflectivity, density, specific heat, and melting point temperature all contribute to the lasers ability to cut the workpiece.
Carbon-dioxide laser. A test target bursts into flame upon irradiation by a continuous-wave kilowatt-level carbon-dioxide laser. The carbon-dioxide laser (CO2 laser) was one of the earliest gas lasers to be developed. It was invented by Kumar Patel of Bell Labs in 1964 [1] and is still one of the most useful types of laser.
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