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In September 2022 Nvidia announced the Jetson Orin Nano. [ 14 ] [ 15 ] The modules have the same 260-pin SO-DIMM connector and 69.6 mm x 45 mm dimensions, and come in two variants. The 4 GB variant provides 20 Sparse or 10 Dense TOPs, using a 512-core Ampere GPU with 16 Tensor cores, while the 8 GB variant doubles those numbers to 40/20 TOPs, a ...
The Orin product line now features SoC and SoM (System-On-Module) based on the core Orin design and scaled for different uses from 60W all the way down to 5W. While less is known about the exact SoC's that are being manufactured, Nvidia has publicly shared detailed technical specifications about the entire Jetson Orin SoM product line.
The Drive AGX Orin board family was announced on December 18, 2019, at GTC China 2019. [20] On May 14, 2020, Nvidia announced that Orin would be utilizing the new Ampere GPU microarchitecture and would begin sampling for manufacturers in 2021 and be available for production in 2022. [ 21 ]
In February 2013, semiconductor company Toshiba Memory (now Kioxia) started shipping samples of a 64 GB NAND flash chip, the first chip to support the then new UFS standard. [20] In April 2015, Samsung's Galaxy S6 family was the first phone to ship with eUFS storage using the UFS 2.0 standard. [21]
DDR5 octuples the maximum DIMM capacity from 64 GB to 512 GB. [8] [3] DDR5 also has higher frequencies than DDR4, up to 8GT/s which translates into 64 GB/s (8 gigatransfers/second × 64-bits/module / 8 bits/byte = 64 GB/s) of bandwidth per DIMM. Rambus announced a working DDR5 dual in-line memory module (DIMM) in September 2017.
A DIMM (Dual In-Line Memory Module) is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front and back) holding DRAM chips and pins . [ 1 ] The vast majority of DIMMs are manufactured in compliance with JEDEC memory standards , although there are proprietary DIMMs.
The specification defined standards for ×4, ×8 and ×16 memory devices with capacities of 2, 4, 8 and 16 Gbit. [1] [47] In addition to bandwidth and capacity variants, DDR4 modules can optionally implement: ECC, which is an extra data byte lane used for correcting minor errors and detecting major errors for better reliability. Modules with ...
The Athlon 64 X2 is the first native dual-core desktop central processing unit (CPU) designed by Advanced Micro Devices (AMD). It was designed from scratch as native dual-core by using an already multi-CPU enabled Athlon 64, joining it with another functional core on one die, and connecting both via a shared dual-channel memory controller/north bridge and additional control logic.
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