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  2. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    The resist material protects the copper from dissolution into the etching solution. The etched board is then cleaned. A PCB design can be mass-reproduced in a way similar to the way photographs can be mass-duplicated from film negatives using a photographic printer. FR-4 glass epoxy is the most common insulating substrate.

  3. FR-4 - Wikipedia

    en.wikipedia.org/wiki/FR-4

    FR-4 is a common material for printed circuit boards (PCBs). A thin layer of copper foil is typically laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates. The copper thickness or copper weight can vary and so is specified separately.

  4. Polychlorinated biphenyl - Wikipedia

    en.wikipedia.org/wiki/Polychlorinated_biphenyl

    Polychlorinated biphenyls (PCBs) ... The 1100 series was a crude PCB material which was distilled to create the 1200 series PCB product. [24]

  5. Phenolic paper - Wikipedia

    en.wikipedia.org/wiki/Phenolic_paper

    Phenolic paper is a material often used to make printed circuit board (PCB) substrates (the flat board to which electronic components and traces are attached). It is a very tough board made of wood fibre and phenolic polymers. It is most commonly brown in colour, and is a fibre reinforced plastic.

  6. Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board...

    A PCB milling machine (referred to as a 'PCB Prototyper') operates in a similar way to a plotter, receiving commands from the host software that control the position of the milling head in the x, y, and (if relevant) z axis. Laser resist ablation involves spraying black paint onto copper clad laminate, then placing the board into CNC laser ...

  7. Conformal coating - Wikipedia

    en.wikipedia.org/wiki/Conformal_coating

    Flow rates and material viscosity are programmed into the computer system, controlling the application so that the desired coating thickness is maintained. This method is effective for large volumes, provided that the PCB is designed for the method.

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