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The Denny's roadside diner in San Jose, California, in 2023, where Nvidia's three co-founders agreed to start the company in 1993 Nvidia's former headquarters which was home to the company through most of its pre-AI period (still in use) Aerial view of Endeavor, the first of the two new Nvidia headquarters buildings, in Santa Clara, California, in 2017.
Jen-Hsun "Jensen" Huang [a] (Chinese: 黃仁勳; pinyin: Huáng Rénxūn; Pe̍h-ōe-jī: N̂g Jîn-hun; born February 17, 1963) is a Taiwanese and American businessman, electrical engineer, and philanthropist who is the president, co-founder, and chief executive officer (CEO) of Nvidia, the world's largest semiconductor company. [2]
Nvidia Chris Malachowsky (born May 2, 1959) is an American electrical engineer and billionaire businessman. [ 1 ] He is noted for having co-founded computer graphics company Nvidia in 1993, and serves as a senior vice president for engineering and operations.
Mark Stevens (born 1960) is an American billionaire venture capitalist, and a partner at S-Cubed Capital in Menlo Park, California. He was previously with Intel and Sequoia Capital. [2] He serves on the board of Nvidia, [1] and is an investor in the Golden State Warriors of the National Basketball Association.
Nvidia Curtis R. Priem (born 1958 or 1959 [ 1 ] ) is an American electrical engineer. After co-founding the Nvidia Corporation , he left the company and sold all of his shares in Nvidia by 2006.
American technology company Nvidia announced plans on 13 September 2020 to acquire ARM from SoftBank, pending regulatory approval, for a value of US$40 billion in stock and cash, which would have been the largest semiconductor acquisition to that date. SoftBank Group would acquire slightly less than a 10% stake in Nvidia, and ARM would maintain ...
In September 2020 the company introduced the world's fastest discrete graphics memory solution. Working with computing technology leader Nvidia, Micron debuted GDDR6X in the Nvidia GeForce RTX 3090 and GeForce RTX 3080 graphics processing units (GPUs). [46] In November 2020, the company unveiled a new 176-layer 3D NAND module.
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