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Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...
A solder paste is essentially powdered solder suspended in flux paste. The tackiness of the flux holds components in place until the soldering reflow process melts the solder. As a result of environmental legislation, most solders today, including solder pastes, are made of lead-free alloys [citation needed].
Additionally, tin is a more corrosive metal, and can eventually lead to the failure of solder baths [clarification needed]. [36] Lead-free construction has also extended to components, pins, and connectors. Most of these pins used copper frames, and either lead, tin, gold or other finishes. Tin finishes are the most popular of lead-free finishes.
For example, tin-lead solder [5] attaches very well to copper metal, but poorly to its oxides, which form quickly at soldering temperatures. By preventing the formation of metal oxides, flux enables the solder to adhere to the clean metal surface, rather than forming beads, as it would on an oxidized surface.
When lead-free solder is used in wave soldering, a slightly modified solder pot may be desirable (e.g. titanium liners or impellers) to reduce maintenance cost due to increased tin-scavenging of high-tin solder. Lead-free solder is prohibited in critical applications, such as aerospace, military and medical projects, because joints are likely ...
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