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  2. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]

  3. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    A solder paste is essentially powdered solder suspended in flux paste. The tackiness of the flux holds components in place until the soldering reflow process melts the solder. As a result of environmental legislation, most solders today, including solder pastes, are made of lead-free alloys [citation needed].

  4. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...

  5. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    The solder used in the process can vary in composition, with different alloys used for different applications. Common solder alloys include tin-lead, tin-silver, and tin-copper, among others. Lead-free solder has also become more widely used in recent years due to health and environmental concerns associated with the use of lead.

  6. Solder - Wikipedia

    en.wikipedia.org/wiki/Solder

    When lead-free solder is used in wave soldering, a slightly modified solder pot may be desirable (e.g. titanium liners or impellers) to reduce maintenance cost due to increased tin-scavenging of high-tin solder. Lead-free solder is prohibited in critical applications, such as aerospace, military and medical projects, because joints are likely ...

  7. Flux (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Flux_(metallurgy)

    For example, tin-lead solder [5] attaches very well to copper metal, but poorly to its oxides, which form quickly at soldering temperatures. By preventing the formation of metal oxides, flux enables the solder to adhere to the clean metal surface, rather than forming beads, as it would on an oxidized surface.

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