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A water block is better at dissipating heat than an air-cooled heatsink due to water's higher specific heat capacity and thermal conductivity. The water is usually pumped through to a radiator which allows a fan pushing air through it to take the heat created from the device and expel it into the air. A radiator is more efficient than a ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...
A heat sink (aluminum) with its heat pipes (copper) and fan (black) A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of ...
CPU heat sink with fan attached A heat sink (aluminium) incorporating a heat pipe (copper) All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. [1]
To cool these components, fans are used to move heated air away from the components and draw cooler air over them. Fans attached to components are usually used in combination with a heat sink to increase the area of heated surface in contact with the air, thereby improving the efficiency of cooling. Fan control is not always an automatic process.
The addition of fins to a heat sink increases its total surface area, resulting in greater cooling effectiveness. There are two types of cooling pads that can be used for air cooling: one is the honeycomb design and another one is excelsior. [citation needed] In all cases, the air has to be cooler than the object or surface from which it is ...
A thermosiphon can efficiently transfer heat over a much wider temperature range and can typically maintain the processor temperature 10–20 °C cooler than a traditional heat sink and fan. In some cases, it is also possible that a thermosiphon may cover multiple heat sources and, design-wise, be more compact than an appropriately sized ...
Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air. Tc = Maximum allowed temperature of the CPU's case (ensuring full performances). Ta = Maximum expected ambient temperature at the inlet of the Heat sink fan. All these parameters are linked together by the following equation: