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A heat sink (aluminum) with its heat pipes (copper) and fan (black) A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of ...
A water block is better at dissipating heat than an air-cooled heatsink due to water's higher specific heat capacity and thermal conductivity. The water is usually pumped through to a radiator which allows a fan pushing air through it to take the heat created from the device and expel it into the air. A radiator is more efficient than a ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
To cool these components, fans are used to move heated air away from the components and draw cooler air over them. Fans attached to components are usually used in combination with a heat sink to increase the area of heated surface in contact with the air, thereby improving the efficiency of cooling. Fan control is not always an automatic ...
CPU heat sink with fan attached A heat sink (aluminium) incorporating a heat pipe (copper) All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. [1]
The addition of fins to a heat sink increases its total surface area, resulting in greater cooling effectiveness. There are two types of cooling pads that can be used for air cooling: one is the honeycomb design and another one is excelsior. [citation needed] In all cases, the air has to be cooler than the object or surface from which it is ...
These systems are replaced with liquid circulation pumps and heat exchanger and/or dry cooler systems. Power use at data centers is often measured in terms of power usage effectiveness (PUE). The definitions of PUE for air-cooled devices and liquid immersion cooled devices are different which makes such direct comparisons inaccurate.
In computing and electronics, liquid cooling involves the technology that uses a special water block to conduct heat away from the processor as well as the chipset. [1] This method can also be used in combination with other traditional cooling methods such as those that use air. The application to microelectronics is either indirect or direct.
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