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Point-to-point wiring is not suitable for automated assembly (though see wire wrap, a similar method that is) and is carried out manually, making it both more expensive and more susceptible to wiring errors than PCBs, as connections are determined by the person doing assembly rather than by an etched circuit board.
A wire feeder is used to supply solder. [23] Both lead-tin and silver-tin material can be soldered. Process recipes will differ depending on the alloy composition. For soldering 44-pin chip carriers to a board using soldering preforms, power levels were on the order of 10 watts and solder times approximately 1 second.
Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask ), creating a mechanical and electrical connection.
Wire wrap construction became popular around 1960 in circuit board manufacturing, and use has now sharply declined. Surface-mount technology has made the technique comparatively much less useful than in previous decades. Solder-less breadboards and the decreasing cost of professionally made PCBs have nearly eliminated this technology.
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
Printed circuit board (PCB) terminal blocks are specially designed with a copper alloy pin of suitable size and length, and can be inserted into printed circuit boards for soldering in place. Some designs provide features that allow the flow of molten solder to ensure a better connection between the circuit traces of the board and the ...
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common.
This wire was developed initially for circuit assembly by the wire wrap technique but also serves well for miniature point-to-point wiring on perfboard. Bare copper wire is useful when merging a number of connections to form an electrical bus such as the circuit's ground , and when there is enough space to properly route connections, instead of ...
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