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Silicon is a peer-reviewed scientific journal published by Springer and founded in 2009 by editor in chief Stephen Clarson. It deals with all aspects of silicon.Published research involves materials biology, materials physics, materials chemistry, materials engineering, and environmental science.
This is a representative list of academic journals and magazines in engineering and its various subfields. Aerospace engineering Aviation Week & Space Technology ...
Pages in category "Semiconductor journals" The following 11 pages are in this category, out of 11 total. This list may not reflect recent changes. I.
The Journal of Electronic Materials is a monthly peer-reviewed scientific journal that publishes studies, research, developments, and applications of materials that produce electronics. The editor-in-chief is Shadi Shahedipour-Sandvik, SUNY Polytechnic Institute.The IEEE/TMS Journal of Electronic Materials (JEM) is jointly sponsored by the IEEE ...
Semiconductor Science and Technology is a peer-reviewed scientific journal covering all applied or explicitly applicable experimental and theoretical studies of the properties of semiconductors and their interfaces, devices, and packaging. The journal publishes different article types including research papers, rapid communications, and topical ...
U.S. Secretary of Commerce Gina Raimondo on Monday, April 15, 2024, visiting the Austin Community College Highland Campus to tour training spaces and talk with students, faculty and leadership.
The publications of the Institute of Electrical and Electronics Engineers (IEEE) constitute around 30% of the world literature in the electrical and electronics engineering and computer science fields, [citation needed] publishing well over 100 peer-reviewed journals. [1]
In 1968, Faraday Press (United States) published the first issue of the English version of the journal, which was published as Radioelectronics and Communications Systems. From 1977, translation and publication of the journal moved to Allerton Press. Since 2007, the English version is distributed by Springer Science+Business Media.