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  2. Power electronic substrate - Wikipedia

    en.wikipedia.org/wiki/Power_electronic_substrate

    The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components. Compared to materials and techniques used in lower power microelectronics , these substrates must carry higher currents and provide a higher voltage isolation (up to several ...

  3. Hardboard - Wikipedia

    en.wikipedia.org/wiki/Hardboard

    The density of hardboard is higher than 500 kg/m 3 (31 lb/cu ft), [4] usually about 800–1,040 kg/m 3 (50–65 lb/cu ft). [5] It differs from particle board and medium-density fiberboard in that the bonding of the wood fibers requires no additional adhesive, the original lignin in the wood fibers sufficing to bond the hardboard together, [ 6 ...

  4. Medium-density fibreboard - Wikipedia

    en.wikipedia.org/wiki/Medium-density_fibreboard

    Although similar manufacturing processes are used in making all types of fibreboard, MDF has a typical density of 600–800 kg/m 3 or 0.022–0.029 lb/in 3, in contrast to particle board (500–800 kg/m 3) and to high-density fibreboard (600–1,450 kg/m 3). In addition, MDF typically has an MOR of 40 MPa and an MOE of 3 GPa.

  5. Frame and panel - Wikipedia

    en.wikipedia.org/wiki/Frame_and_panel

    Wood will expand and contract across the grain, and a wide panel made of solid wood could change width by a half of an inch, warping the door frame. By allowing the wood panel to float, it can expand and contract without damaging the door. A typical panel would be cut to allow 1/4" (5 mm) between itself and the bottom of the groove in the frame.

  6. Panelling - Wikipedia

    en.wikipedia.org/wiki/Panelling

    39 in (990 mm) wainscoting using 3 in (76 mm) tongue and groove pine boards. Panelling (or paneling in the United States) is a millwork wall covering constructed from rigid or semi-rigid components. [1] These are traditionally interlocking wood, but could be plastic or other materials.

  7. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology , one of several package technologies that connect ICs to the ...

  8. KCE Electronics - Wikipedia

    en.wikipedia.org/wiki/KCE_Electronics

    KCE Electronics is a Thai electronics manufacturer, mostly involved in the production of circuitboards. It was founded in 1992, and employs 4,703 people. It was founded in 1992, and employs 4,703 people.

  9. Plugboard - Wikipedia

    en.wikipedia.org/wiki/Plugboard

    A plugboard or control panel ... control panels ranged in size from 6 1/4" by 10 3/4" ... for a solderless plugboard used for prototyping electronics; References

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