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64 KiB per core 2x256 KiB – 2 MiB 0 KiB – 3 MiB Intel Core: Txxxx Lxxxx Uxxxx Yonah: 2006–2008 1.06 GHz – 2.33 GHz Socket M: 65 nm 5.5 W – 49 W 1 or 2 533 MHz, 667 MHz 64 KiB per core 2 MiB N/A Intel Core 2: Uxxxx Lxxxx Exxxx Txxxx P7xxx Xxxxx Qxxxx QXxxxx Allendale Conroe Merom Penryn Kentsfield Wolfdale Yorkfield: 2006–2011 1.06 ...
The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.
Ryzen 3 Pro 3200GE: Sep 30, 2019: Ryzen 3 3200G: 3.6 4.0 1250 1280 65 W Jul 7, 2019: US $99 [85] Ryzen 3 Pro 3200G: Sep 30, 2019: OEM Ryzen 5 Pro 3350GE: 3.3 3.9 Radeon Graphics 640:40:16 10 CU 1200 1536 35 W Jul 21, 2020: Ryzen 5 Pro 3350G: 4 (8) 3.6 4.0 1300 1830.4 65 W Ryzen 5 3400GE: 3.3 Vega 11 704:44:16 11 CU 35 W Jul 7, 2019: Ryzen 5 Pro ...
Ryzen 3 PRO 2100GE [2] found in some OEM markets in limited quantities. Ryzen (/ ˈ r aɪ z ən / RY-zən) [3] is a brand [4] of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture.
Zen 2 is a computer processor microarchitecture by AMD.It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC.The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for ...
Core i3-3xx does not support for Turbo Boost, L3 cache in Core i5-5xx processors is reduced to 3 MB, while the Core i5-6xx uses the full cache, [46] Clarkdale is sold as Core i5-6xx, along with related Core i3 and Pentium processors. It has Hyper-Threading enabled and the full 4 MB L3 cache.
Intel 5 Series is a computing architecture introduced in 2008 that improves the efficiency and balances the use of communication channels in the motherboard. The architecture consists primarily of a central processing unit (CPU) (connected to the graphics card and memory) and a single chipset (connected to motherboard components).
ROCm [3] is an Advanced Micro Devices (AMD) software stack for graphics processing unit (GPU) programming. ROCm spans several domains: general-purpose computing on graphics processing units (GPGPU), high performance computing (HPC), heterogeneous computing.