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This makes trench capacitors suitable for constructing embedded DRAM (eDRAM) (Jacob, p. 357). Disadvantages of trench capacitors are difficulties in reliably constructing the capacitor's structures within deep holes and in connecting the capacitor to the access transistor's drain terminal (Kenner, p. 44).
The two most common types of DRAM memory cells since the 1980s have been trench-capacitor cells and stacked-capacitor cells. [25] Trench-capacitor cells are where holes (trenches) are made in a silicon substrate, whose side walls are used as a memory cell, whereas stacked-capacitor cells are the earliest form of three-dimensional memory (3D ...
in DRAM memory circuits, capacitor trenches may be 10–20 μm deep, in MEMS, DRIE is used for anything from a few micrometers to 0.5 mm. in irregular chip dicing, DRIE is used with a novel hybrid soft/hard mask to achieve sub-millimeter etching to dice silicon dies into lego-like pieces with irregular shapes. [7] [8] [9]
In addition, the Ram 1500 features active front grille shutters, which are now driver-adjustable, as well as a lower drag coefficient for improved aerodynamic performance. Also new for the Ram 1500 is a new 4×4 Off-Road Package, which includes a factory-equipped suspension lift, off-road tires, and enhanced off-road performance and handling ...
Software can "partition" a portion of a computer's RAM, allowing it to act as a much faster hard drive that is called a RAM disk. A RAM disk loses the stored data when the computer is shut down, unless memory is arranged to have a standby battery source, or changes to the RAM disk are written out to a nonvolatile disk.
Ferroelectric RAM (FeRAM, F-RAM or FRAM) is a random-access memory similar in construction to DRAM but using a ferroelectric layer instead of a dielectric layer to achieve non-volatility. FeRAM is one of a growing number of alternative non-volatile random-access memory technologies that offer the same functionality as flash memory .
The Ram 1500 (2010–2018), Ram 1500 Classic (2019–2024), Ram 2500 through 5500, and Ram DX chassis cab (Mexican market) were assembled at Saltillo Truck Assembly Plant in Coahuila, Mexico. From 2009 to 2018, the Ram 1500 (DS) was assembled at Warren Truck Assembly in Warren, Michigan, and the 2009 Dodge Ram 1500 was also assembled at Saint ...
Shallow trench isolation (STI), also known as box isolation technique, is an integrated circuit feature which prevents electric current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers and smaller.