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The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.
All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E, R5 2600E, R5 1600AF and R3 1200AF which support it at DDR4-2666 speeds. All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. L2 cache: 512 KB per core.
As the first largely "ground up redesign" of the Zen CPU core since the architecture family's original release in early 2017 with Zen 1/Ryzen 1000, Zen 3 was a significant architectural improvement over its predecessors; having a very significant IPC increase of +19% over the prior Zen 2 architecture in addition to being capable of reaching higher clock speeds.
Some Xeon Phi processors support four-way hyper-threading, effectively quadrupling the number of threads. [1] Before the Coffee Lake architecture, most Xeon and all desktop and mobile Core i3 and i7 supported hyper-threading while only dual-core mobile i5's supported it.
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.
Intel is ditching the Celeron and Pentium names for its laptop chips in favor of the simple 'Intel Processor' badge.
Consequently, all of this forced AMD to completely abandon the entire high-end CPU market (including desktop, laptops, and server/enterprise) until Ryzen's release in 2017. Ryzen is the consumer-level implementation of the newer Zen microarchitecture , a complete redesign that marked the return of AMD to the high-end central processing unit ...
Tiger Lake processors launched on September 2, 2020. They are part of the Tiger Lake-U family (however, they end with the suffixes -G4 and -G7 instead of -U) and include dual-core and quad-core 9 W (7–15 W) TDP and 15 W (12–28 W) TDP models. [5] They power 2020 Intel Evo laptops.
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