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The 65 nm process is an advanced lithographic node used in volume CMOS semiconductor fabrication. Printed linewidths (i.e. transistor gate lengths) can reach as low as 25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm.
The reduction to 65 nm reduced the existing 230 mm 2 die based on the 90 nm process to half its current size, about 120 mm 2, greatly reducing IBM's manufacturing cost as well. On 12 March 2007, IBM announced that it started producing 65 nm Cells in its East Fishkill fab. The chips produced there are apparently only for IBMs own Cell blade ...
The technology used a 32 nm SOI process, two CPU cores per module, and up to four modules, ranging from a quad-core design costing approximately US$130 to a $280 eight-core design. Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in ...
The PowerXCell is manufactured on a 65 nm process, and adds support for up to 32 GB of slotted DDR2 memory, as well as dramatically improving double-precision floating-point performance on the SPEs from a peak of about 12.8 GFLOPS to 102.4 GFLOPS total for eight SPEs, which, coincidentally, is the same peak performance as the NEC SX-9 vector ...
In CPU fabrications, a die shrink always involves an advance to a lithographic node as defined by ITRS (see list). For GPU and SoC manufacturing, the die shrink often involves shrinking the die on a node not defined by the ITRS, for instance, the 150 nm, 110 nm, 80 nm, 55 nm, 40 nm and more currently 8 nm nodes, sometimes referred to as "half-nodes".
Silicon on insulator (SOI) technology has been used in AMD's 130 nm, 90 nm, 65 nm, 45 nm and 32 nm single, dual, quad, six and eight core processors made since 2001. [73] During the transition from 200 mm to 300 mm wafers in 2001, many bridge tools were used which could process both 200 mm and 300 mm wafers. [74]
65 nm – the average half-pitch of a memory cell manufactured circa 2005–2006; 58 nm – height of a T7 bacteriophage; 90 nm – human immunodeficiency virus (HIV) (generally, viruses range in size from 20 nm to 450 nm) 90 nm – the average half-pitch of a memory cell manufactured circa 2002–2003
Cell BE, 64-bit PPE-core, 2 way multithreading, VMX, 512 kB L2 cache, 8x SPE, 8x 256 kB Local Store memory, 3.2 GHz, follows the PowerPC 2.02 ISA; Cell BE 65 nm, same as above but manufactured on a 65 nm process; PowerXCell 8i, same as above but with enhanced double precision SPEs and support for DDR-RAM