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Design for testing or design for testability (DFT) consists of IC design techniques that add testability features to a hardware product design. The added features make it easier to develop and apply manufacturing tests to the designed hardware.
Scan chain is a technique used in design for testing. The objective is to make testing easier by providing a simple way to set and observe every flip-flop in an IC. The basic structure of scan include the following set of signals in order to control and observe the scan mechanism. Scan_in and scan_out define the input and output of a scan chain.
The complexity of modern IC design, as well as market pressure to produce designs rapidly, has led to the extensive use of automated design tools in the IC design process. The design of some processors has become complicated enough to be difficult to fully test, and this has caused problems at large cloud providers. [ 2 ]
A common form of in-circuit testing uses a bed-of-nails tester.This is a fixture that uses an array of spring-loaded pins known as "pogo pins". When a printed circuit board is aligned with and pressed down onto the bed-of-nails tester, the pins make electrical contact with locations on the circuit board, allowing them to be used as test points for in-circuit testing.
ATPG (acronym for both automatic test pattern generation and automatic test pattern generator) is an electronic design automation method or technology used to find an input (or test) sequence that, when applied to a digital circuit, enables automatic test equipment to distinguish between the correct circuit behavior and the faulty circuit behavior caused by defects.
Testing is the real-world counterpart to verification; testing involves physically building at least a prototype of the design and then (in combination with the test procedures in the specification or added to it) checking the circuit does what it was designed to.
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals.
In the automated design of integrated circuits, signoff (also written as sign-off) checks is the collective name given to a series of verification steps that the design must pass before it can be taped out. This implies an iterative process involving incremental fixes across the board using one or more check types, and then retesting the design.