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2. Solder ball - Wikipedia

   en.wikipedia.org/wiki/Solder_ball

   The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] Ball grid array, chip-scale package, and flip chip packages generally use solder balls.

3. Flip chip - Wikipedia

   en.wikipedia.org/wiki/Flip_chip

   Solder balls can be mounted on the chips by separately making the balls and then attaching them to the chips by using a vacuum pick up device to pick up the balls and then placing them into a chip with flux applied on contact pads for the balls, or by electroplating in which seed metals are first deposited onto a wafer with the chips to be bumped.

4. Ball grid array - Wikipedia

   en.wikipedia.org/wiki/Ball_grid_array

   A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.

5. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Micro ball grid array : Ball spacing less than 1 mm; Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm; Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.

6. Component placement - Wikipedia

   en.wikipedia.org/wiki/Component_placement

   Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously ...

7. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...

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   mail.aol.com

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9. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   A hot air gun or hot air station is used to heat devices and melt solder, and specialised tools are used to pick up and position often tiny components. A rework station is a place to do this work—the tools and supplies for this work, typically on a workbench. Other kinds of rework require other tools. [1]