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  2. LPDDR - Wikipedia

    en.wikipedia.org/wiki/LPDDR

    Both LPDDR4 and LPDDR5 allow up to 10 bits of column address, but the names are different. LPDDR4's C0–C9 are renamed B0–B3 and C0–C5. As with LPDDR4, writes must start at a multiple-of-16 address with B0–B3 zero, but reads may request a burst be transferred in a different order by specifying a non-zero value for B3.

  3. Open NAND Flash Interface Working Group - Wikipedia

    en.wikipedia.org/wiki/Open_NAND_Flash_Interface...

    A new NV-LPDDR4 lower power interface is introduced with speeds up to 2400MT/s. With the NV-LPDDR4 interface, an optional Data Bus Inversion (DBI) feature is defined. New smaller footprint BGA-178b, BGA-154b and BGA-146b packages are added. ONFI5.0 also includes other errata related to the ONFI4.2 specification. [19]

  4. List of UNISOC systems on chips - Wikipedia

    en.wikipedia.org/wiki/List_of_UNISOC_systems_on...

    LPDDR3, LPDDR4/4X A7862E 12 nm 8 LPDDR3, LPDDR4/4X Bluetooth 5 BLE GPS + Beidou + Glonass / GPS + Galileo + Glonass 3× SDIO 3.0 / USB 2.0 Type-C, USB 1.1 and OTG 2.0 / 4× SPI / 4× I2S / 8× I2C / 7× UART 150 GPIO V8811 22 nm 1 Integrated 16 Mb/32M Flash Supports 3GPP NB-IoT R13/R14/R15/R16 8910DM 28 nm 2

  5. List of Intel Atom processors - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_Atom_processors

    DDR3L/LPDDR3/LPDDR4 dual-channel memory controller supporting up to 8 GB; support for DDR3L with ECC; Display controller with 1 MIPI DSI port and 2 DDI ports (eDP 1.3, DP 1.1a, or HDMI 1.4b) Integrated Intel HD Graphics (Gen9) GPU; PCI Express 2.0 controller supporting 6 lanes (3 dedicated and 3 multiplexed with USB 3.0); 4 lanes available ...

  6. ChangXin Memory Technologies - Wikipedia

    en.wikipedia.org/wiki/ChangXin_Memory_Technologies

    As of 2020, ChangXin manufactured LPDDR4 and DDR4 memory on a 19 nm process, with a capacity of 40,000 wafers per month. [1] The company planned to increase output to 120,000 wafers per month and launch 17 nm LPDDR5 by the end of 2022, with a target total capacity of 300,000 wafers per month in the long-term.

  7. LPDDR4 - Wikipedia

    en.wikipedia.org/?title=LPDDR4&redirect=no

    To a section: This is a redirect from a topic that does not have its own page to a section of a page on the subject. For redirects to embedded anchors on a page, use {{R to anchor}} instead.

  8. Apple M1 - Wikipedia

    en.wikipedia.org/wiki/Apple_M1

    Apple M1 is a series of ARM-based system-on-a-chip (SoC) designed by Apple Inc., launched 2020 to 2022.It is part of the Apple silicon series, as a central processing unit (CPU) and graphics processing unit (GPU) for its Mac desktops and notebooks, and the iPad Pro and iPad Air tablets. [4]

  9. Robert H. Dennard - Wikipedia

    en.wikipedia.org/wiki/Robert_H._Dennard

    Known for: Inventing DRAM, Dennard scaling: Awards: Harvey Prize (1990) IEEE Edison Medal (2001) IEEE Medal of Honor (2009) Kyoto Prize (2013) Robert N. Noyce Award (2019) Scientific career