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  2. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    Commercial extruded aluminium heat sinks have a thermal resistance (heat sink to ambient air) ranging from 0.4 °C/W for a large sink meant for TO-3 devices, up to as high as 85 °C/W for a clip-on heat sink for a TO-92 small plastic case. [3]

  3. Fin (extended surface) - Wikipedia

    en.wikipedia.org/wiki/Fin_(extended_surface)

    Thus, adding a fin to an object, increases the surface area and can sometimes be an economical solution to heat transfer problems. One-piece finned heat sinks are produced by extrusion, casting, skiving, or milling.

  4. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...

  5. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  6. Rule based analysis of extrusion process - Wikipedia

    en.wikipedia.org/wiki/Rule_based_analysis_of...

    In direct extrusion the billet is pushed through the die with ram pressure, whereas in indirect extrusion a die moves relative to the container. Rule based analysis of extrusion process would help to determine a set of rules essential for consideration while designing a product, or even during cost estimation of a product. Some rules are ...

  7. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    The only other IC with a heat sink is the RAMDAC (right from CPU). See also: Passive cooling Passive heatsink cooling involves attaching a block of machined or extruded metal to the part that needs cooling.

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