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Reliability of semiconductors is kept high through several methods. Cleanrooms control impurities, process control controls processing, and burn-in (short term operation at extremes) and probe and test reduce escapes. Probe (wafer prober) tests the semiconductor die, prior to packaging, via micro-probes connected to test equipment.
The time it will take for the oxide to break under this constant applied voltage is called the time-to-failure. The test is then repeated several times to obtain a distribution of time-to-failure. [1] These distributions are used to create reliability plots and to predict the TDDB behavior of oxide at other voltages.
Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals.
QBD is the term applied to the charge-to-breakdown measurement of a semiconductor device. It is a standard destructive test method used to determine the quality of gate oxides in MOS devices. It is equal to the total charge passing through the dielectric layer (i.e. electron or hole fluence multiplied by the elementary charge) just before failure.
The goal of HALT is to proactively find weaknesses and fix them, thereby increasing product reliability. Because of its accelerated nature, HALT is typically faster and less expensive than traditional testing techniques. HALT is a test technique called test-to-fail, where a product is tested until failure. HALT does not help to determine or ...
Shear testing is the alternative method to determine the strength a bond can withstand. Various variants of shear testing exist. Like with pull testing, the objective is to recreate the failure mode of interest in the test. If that is not possible, the operator should focus on putting the highest possible load on the bond. [18]
Semiconductor ATE, named for testing semiconductor devices, can test a wide range of electronic devices and systems, from simple components (resistors, capacitors, and inductors) to integrated circuits (ICs), printed circuit boards (PCBs), and complex, completely assembled electronic systems.