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A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
An intermediate form of construction uses terminal strips (sometimes called "tag boards"), eyelet boards or turret boards. Note that if components are arranged on boards with tags, eyelets or turrets at both ends and wires going to the next components, then the construction is correctly called tag, eyelet or turret construction respectively, as ...
Board-to-board (BTB) connectors are used to connect printed circuit boards (PCB), electronic components that contain a conductive pattern printed on the surface of the insulating base in an accurate and repeatable manner. Each terminal on a BTB connector is connected to a PCB. A BTB connector includes housing and a specific number of terminals.
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
A via fence consists of a row of via holes, that is, holes that pass through the substrate and are metallised on the inside to connect to pads on the top and bottom of the substrate. In a stripline format both the top and bottom of the dielectric sheet are covered with a metal ground plane so any via holes are automatically grounded at both ends.
Modern PCB design software typically provides "interactive routers"—the drafter selects a pad and clicks a few places to give the EDA tool an idea of where to go, and the EDA tool tries to place wires as close to that path as possible without violating design rule checking (DRC). Some more advanced interactive routers have "push and shove ...
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In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.