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2. Cricut - Wikipedia

   en.wikipedia.org/wiki/Cricut

   Cutting plotters, heat press. Number of employees. 690 [1] Website. cricut.com. Cricut, Inc. is an American brand of cutting plotters, or computer-controlled cutting machines, designed for home crafters. The machines are used for cutting paper, felt, vinyl, fabric [2] and other materials such as leather, matboard, and wood.

3. Laser cutting - Wikipedia

   en.wikipedia.org/wiki/Laser_cutting

   Laser cutting. Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics.

4. Digital modeling and fabrication - Wikipedia

   en.wikipedia.org/wiki/Digital_modeling_and...

   The laser cutter is a machine that uses a laser to cut materials such as chip board, matte board, felt, wood, and acrylic up to 3/8 inch (1 cm) thickness. The laser cutter is often bundled with a driver software which interprets vector drawings produced by any number of CAD software platforms.

5. Laser beam machining - Wikipedia

   en.wikipedia.org/wiki/Laser_beam_machining

   Laser beam machining (LBM) is a form of machining that uses heat directed from a laser beam. This process uses thermal energy to remove material from metallic or nonmetallic surfaces. The high frequency of monochromatic light will fall on the surface, thus heating, melting and vaporizing the material due to the impinge of photons (see Coulomb ...

6. Nd:YAG laser - Wikipedia

   en.wikipedia.org/wiki/Nd:YAG_laser

   Nd:YAG laser with lid open showing frequency-doubled 532 nm green light. Nd:YAG laser rod. Nd:YAG (neodymium-doped yttrium aluminum garnet; Nd:Y3Al5O12) is a crystal that is used as a lasing medium for solid-state lasers. The dopant, neodymium in the +3 oxidation state, Nd (III), typically replaces a small fraction (1%) of the yttrium ions in ...

7. Die singulation - Wikipedia

   en.wikipedia.org/wiki/Die_singulation

   Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.