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Fusion bonded epoxy coating, also known as fusion-bond epoxy powder coating and commonly referred to as FBE coating, is an epoxy -based powder coating that is widely used to protect steel pipe used in pipeline construction from corrosion. It is also commonly used to protect reinforcing bars (though being phased out as of 2005 [1]) and on a wide ...
Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called epoxy. [1] The IUPAC name for an epoxide group is an oxirane.
Thermosetting polymer. In materials science, a thermosetting polymer, often called a thermoset, is a polymer that is obtained by irreversibly hardening ("curing") a soft solid or viscous liquid prepolymer (resin). [1] Curing is induced by heat or suitable radiation and may be promoted by high pressure or mixing with a catalyst.
Bisphenol A diglycidyl ether (commonly abbreviated BADGE or DGEBA) is an organic compound and is a liquid epoxy resin. [1][2][3][4][5] The compound is a colorless viscous liquid (commercial samples can appear pale straw-coloured). [6][7] It is a key component of many epoxy resin formulations. Addition of further Bisphenol A and a catalyst and ...
Chip on board (COB) is a method of circuit board manufacturing in which the integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. [1] Chip on board eliminates the packaging of individual semiconductor devices, which allows a completed product to be less ...
Electrophoretic deposition (EPD), is a term for a broad range of industrial processes which includes electrocoating, cathodic electrodeposition, anodic electrodeposition, and electrophoretic coating, or electrophoretic painting. A characteristic feature of this process is that colloidal particles suspended in a liquid medium migrate under the ...
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