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Uranium glass used as lead-in seals in a vacuum capacitor. Glass-to-metal seals are a type of mechanical seal which joins glass and metal surfaces. They are very important elements in the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass-encapsulated semiconductor diodes, reed switches, glass windows in metal cases, and metal or ceramic packages of ...
304 stainless steel is a common choice of a stainless steel. 304L stainless steel, a low-carbon variant of 304 steel, is used for ultra-high vacuum systems. 316L stainless steel a low-carbon and low-magnetic stainless steel, used in accelerator technologies. 347 stainless steel does not accept high polish. 321 stainless steel is chosen when low ...
Certain epoxy resins and their processes can create a hermetic bond to copper, brass, stainless steel, specialty alloys, plastic, or epoxy itself with similar coefficients of thermal expansion, and are used in the manufacture of hermetic electrical and fiber optic hermetic seals. Epoxy-based seals can increase signal density within a ...
In physical chemistry and engineering, passivation is coating a material so that it becomes "passive", that is, less readily affected or corroded by the environment. . Passivation involves creation of an outer layer of shield material that is applied as a microcoating, created by chemical reaction with the base material, or allowed to build by spontaneous oxidation
Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.
Anodic bonding is commonly used to seal glass to silicon wafers in electronics and microfluidics. Anodic bonding, also known as field assisted bonding or electrostatic sealing, [1] is mostly used for connecting silicon/glass and metal/glass through electric fields. The requirements for anodic bonding are clean and even wafer surfaces and atomic ...
Solvent bonding differs from adhesive bonding, because the solvent does not become a permanent addition to the joined substrate. [4] Solvent bonding differs from other plastic welding processes in that heating energy is generated by the chemical reaction between the solvent and thermoplastic, and cooling occurs during evaporation of the solvent ...
When bonding plastics, in particular with solvent-based adhesives, diffusion processes can also play a role. In this case, the plastic at the substrate surface is dissolved by the solvent contained in the adhesive. This leads to an increased mobility of the plastic's polymer chains, which in turn allows penetration by those of the adhesive.