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2. Printed circuit board - Wikipedia

   en.wikipedia.org/wiki/Printed_circuit_board

   A printed circuit board (PCB), ... Available standard laminate thickness are listed in ANSI/IPC-D-275. [23] The cloth or fiber material used, resin material, ...

3. Conformal coating - Wikipedia

   en.wikipedia.org/wiki/Conformal_coating

   An IBM circuit board from a NASA Space Shuttle computer with a conformal coating applied. Conformal coating is a protective, breathable coating of thin polymeric film applied to printed circuit boards (PCBs). Conformal coatings are typically applied with 25–250 μm [1] thickness on electronic circuitry to protect against moisture and other ...

4. FR-4 - Wikipedia

   en.wikipedia.org/wiki/FR-4

   FR-4 is a common material for printed circuit boards (PCBs). A thin layer of copper foil is typically laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates. The copper thickness or copper weight can vary and so is specified separately.

5. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist.

6. Perfboard - Wikipedia

   en.wikipedia.org/wiki/Perfboard

   Top of a copper clad Perfboard with solder pads for each hole. Perfboard is a material for prototyping electronic circuits.It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of 0.1 inches (2.54 mm) spacing.

7. Thick-film technology - Wikipedia

   en.wikipedia.org/wiki/Thick-film_technology

   There are numerous steps in thick film manufacturing which need careful control, like roughness of the substrate, curing temperatures and times of pastes, selected stencil thickness vs. paste type, etc., [10] [11] Therefore the number of pastes used and process steps define the complexity of the process and cost of the final product.