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Coating material (after curing) should have a thickness of 30–130 μm (0.0012–0.0051 in) when using acrylic resin, epoxy resin, or urethane resin. For silicone resin, the coating thickness recommended by the IPC standards is 50–210 μm (0.0020–0.0083 in).
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
1/2 oz/ft 2 foil is not widely used as a finished copper weight, but is used for outer layers when plating for through holes will increase the finished copper weight Some PCB manufacturers refer to 1 oz/ft 2 copper foil as having a thickness of 35 μm (may also be referred to as 35 μ, 35 micron, or 35 mic).
These parameters are derived from two ratios: the ratio M = m 1 / m 2 of the plating thickness of a specified region of the cathode "close" to the anode to the thickness of a region "far" from the cathode and the ratio L = x 2 / x 1 of the distances of these regions through the
Three major kinds of vias are shown in right figure. The basic steps of making a PCB are: making the substrate material and stacking it in layers; through-drilling of plating the vias; and copper trace patterning using photolithography and etching. With this standard procedure, possible via configurations are limited to through-holes.
Before plating, the surface of the material must be thoroughly cleaned. Unwanted solids left on the surface cause poor plating. Cleaning is usually achieved by a series of chemical baths, including non-polar solvents to remove oils and greases, as well as acids and alkalis to remove oxides, insoluble organics, and other surface contaminants.
Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering. Compared to the traditional HASL process, the OSP process is widely used in the electronics manufacturing industry because it does not ...
IPC standards revised the definition of a microvia in 2013 to a hole with depth to diameter aspect ratio of 1:1 or less, and the hole depth not to exceed 0.25mm. Previously, microvia was any hole less than or equal to 0.15mm in diameter [ 2 ]
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