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While pipe sizes in Australia are inch-based, they are classified by outside rather than inside diameter (e.g., a nominal 3 ⁄ 4 inch copper pipe in Australia has measured diameters of 0.750 inches outside and 0.638 inches inside, whereas a nominal 3 ⁄ 4 inch copper pipe in the U.S. and Canada has measured diameters of 0.875 inch outside and ...
Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.
Soldering copper pipes using a propane torch and a lead-free solder Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point , chemical reactivity, mechanical properties, toxicity, and other properties.
The welding of metals differs from soldering and brazing in that the joint is made without adding a lower-melting-point material (e.g. solder); instead, the pipe or tubing material is partially melted, and the fitting and piping are directly fused. This generally requires piping and fitting to be the same (or compatible) material.
Copper tubing conducts heat away much faster than a conventional hand-held soldering iron or gun can provide, so a propane torch is most commonly used to deliver the necessary power; for large tubing sizes and fittings a MAPP-fueled, acetylene-fueled, or propylene-fueled torch is used with atmospheric air as the oxidizer; MAPP/oxygen or ...
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]
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The size and shape of the metal particles in the solder paste determines how well the paste will "print". A solder ball is spherical in shape; this helps in reducing surface oxidation and ensures good joint formation with the adjoining particles. Irregular particle sizes are not used, as they tend to clog the stencil, causing printing defects.
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