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2. Low Pin Count - Wikipedia

   en.wikipedia.org/wiki/Low_Pin_Count

   Low Pin Count interface Winbond chip Trusted Platform Module installed on a motherboard, and using the LPC bus. The Low Pin Count (LPC) bus is a computer bus used on IBM-compatible personal computers to connect low-bandwidth devices to the CPU, such as the BIOS ROM (BIOS ROM was moved to the Serial Peripheral Interface (SPI) bus in 2006 [1]), "legacy" I/O devices (integrated into Super I/O ...

3. ATX - Wikipedia

   en.wikipedia.org/wiki/ATX

   An ATX power supply provides a number of peripheral power connectors and (in modern systems) two connectors for the motherboard: an 8-pin (or 4+4-pin) auxiliary connector providing additional power to the CPU and a main 24-pin power supply connector, an extension of the original 20-pin version. 20-pin Molex 39-29-9202 at the motherboard. 20-pin ...

4. Motherboard form factor - Wikipedia

   en.wikipedia.org/wiki/Motherboard_form_factor

   Also known as Full AT, it was popular during the era of the Intel 80386 microprocessor. Superseded by ATX. Baby-AT: IBM: 1985 216 × 254–330 mm (8.5 × 10–13 in) IBM's 1985 successor to the AT motherboard. Functionally equivalent to the AT, it became popular due to its significantly smaller size. ATX: Intel: 1995 305 × 244 mm (12 × 9.6 in)

5. ETX (form factor) - Wikipedia

   en.wikipedia.org/wiki/ETX_(form_factor)

   ETX module CX700M from Aaeon Kontron ETX-PM16 top view Kontron ETX-PM16 bottom view with connectors. ETX, standing for Embedded Technology eXtended, is an integrated and compact 95 × 125 mm (3.7 × 4.9 in) computer-on-module (COM) form factor, which can be used in a design application much like an integrated circuit component.

6. Modular connector - Wikipedia

   en.wikipedia.org/wiki/Modular_connector

   The first types of small modular telephone connectors were created by AT&T in the mid-1960s for the plug-in handset and line cords of the Trimline telephone. [1] Driven by demand for multiple sets in residences with various lengths of cords, the Bell System introduced customer-connectable part kits and telephones, sold through PhoneCenter stores in the early 1970s. [2]

7. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Thin small-outline package (TSOP): thinner than SOIC with smaller pin spacing of 0.5 mm. Shrink small-outline package (SSOP): pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm. Thin shrink small-outline package (TSSOP). Quarter-size small-outline package (QSOP): with pin spacing of 0.635 mm.