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Variation of WLCSP. Like a BGA package but with the interposer built directly atop the die and encapsulated alongside it. eWLB: Embedded wafer level ball grid array: Variation of WLCSP. MICRO SMD-Chip-size package (CSP) developed by National Semiconductor [21] COB: Chip on board: Bare die supplied without a package.
A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.
A clear variation is bumpered quad flat package (BQFP) with extensions at the four corners to protect the leads against mechanical damage before the unit is soldered. Heat sink quad flat package, heatsink very thin quad flat-pack no-leads is a package with no component leads extending from the IC. Pads are spaced along the sides of the IC with ...
Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. [1] Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB).
The land grid array is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. [2]
The package on a package technique tries to combine the benefits of traditional packaging with the benefits of die-stacking techniques, while avoiding their drawbacks. Traditional packaging places each die in its own package, a package designed for normal PCB assembly techniques that place each package directly on the PCB side-by-side.
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CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...
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