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The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.
All the CPUs support DDR4-2666 (DDR4-2933 Ryzen) in dual-channel mode. L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 16 PCIe 3.0 lanes. Includes integrated GCN 5th generation GPU. Fabrication process: GlobalFoundries 14LP.
Rembrandt Ryzen 6000 series (laptop) Rembrandt-R Ryzen 7035 series (laptop) Zen 4 series CPUs and APUs (released 2022) Raphael Ryzen 7000 series (desktop) Storm Peak Ryzen Threadripper 7000 series (desktop) Dragon Range Ryzen 7045 series (laptop) Phoenix Ryzen 8000 APU series (desktop) and Ryzen 7040 series (laptop) Hawk Point Ryzen 8040/8045 ...
It is concluded that motherboards with the Knoll Activator would be built with I/O from the processor and low-cost I/O chips. [ 19 ] Individual chipset models differ in the number of PCI Express lanes, USB ports, and SATA connectors, as well as supported technologies; the table below shows these differences.
Processor overclocking TDP CPU support Architecture Part number CrossFire SLI SATA ports RAID AMD StoreMI Excavator Zen Zen+ Zen 2 Zen 3; A300 Feb 2017: None Untested None None Yes [1] No [2] No ~120 μW [c] No Yes [3] [4] Knoll Express [5] 100-CG2978 218-0892000 KNOLL1 X300 Yes Yes [6] unknown Pro 500 Jan 2020 [7] Unknown No Partial [d] 218 ...
AMD Zen 3+ Family 19h – 2022 revision of Zen 3 used in Ryzen 6000 mobile processors using a 6 nm process. AMD Zen 4 Family 19h – fourth generation Zen architecture, in 5 nm process. [5] Used in Ryzen 7000 consumer processors on the new AM5 platform with DDR5 and PCIe 5.0 support. Adds support for AVX-512 instruction set.
Zen 3 was released on November 5, 2020, [30] using a more matured 7 nm manufacturing process, powering Ryzen 5000 series CPUs and APUs [30] (codename "Vermeer" (CPU) and "Cézanne" (APU)) and Epyc processors (codename "Milan"). Zen 3's main performance gain over Zen 2 is the introduction of a unified CCX, which means that each core chiplet is ...
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. [4] [5] [6] It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. [7]
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