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The different parts of Elmer software may be used independently. Whilst the main module is the ElmerSolver tool, which includes many sophisticated features for physical model solving, the additional components are required to create a full workflow. For pre- and post-processing other tools, such as Paraview can be used to visualise the output.
In a radio receiver circuit, the RF front end, short for radio frequency front end, is a generic term for all the circuitry between a receiver's antenna input up to and including the mixer stage. [1] It consists of all the components in the receiver that process the signal at the original incoming radio frequency (RF), before it is converted to ...
FEM: 3D structurers (including 3D antennas), waveguides, 3D filters, PCBs, multi-layer PCBs, LTCC, HTCC, on-chip Passives, printed antennas. Integrated into Microwave Office. JCMsuite: commercial Yes Yes Yes Yes Yes Automatic, error-controlled FEM: Nano- and micro-photonic applications (light scattering, [1] waveguide modes, [2] optical ...
NASTRAN was designed from the beginning to consist of several modules. A module is a collection of FORTRAN subroutines designed to perform a specific task—processing model geometry, assembling matrices, applying constraints, solving matrix problems, calculating output quantities, conversing with the database, printing the solution, and so on.
Front-End Engineering (FEE), or Front-End Engineering Design (FEED), is an engineering design approach used to control project expenses and thoroughly plan a project before a fix bid quote is submitted. [1] It may also be referred to as Pre-project planning (PPP), front-end loading (FEL), feasibility analysis, or early project planning.
Atheros Intellon 1200 AFE-Chip as companion for an INT 5500 PowerLine-IC. An analog front-end (AFE or analog front-end controller AFEC) is a set of analog signal conditioning circuitry that uses sensitive analog amplifiers, often operational amplifiers, filters, and sometimes application-specific integrated circuits for sensors, radio receivers, and other circuits to provide a configurable and ...
A thin-film bulk acoustic resonator (FBAR or TFBAR) is a device consisting of a piezoelectric material manufactured by thin film methods between two conductive – typically metallic – electrodes and acoustically isolated from the surrounding medium.
Module physical connection: land grid array, through-hole, and castellated boardlet (from left to right) A variety of methods are used to attach an RF module to a printed circuit board, either with through-hole technology or surface-mount technology. Through-hole technology allows the module to be inserted or removed without soldering.