enow.com Web Search

Search results

1. Results from the WOW.Com Content Network

2. Fan-out wafer-level packaging - Wikipedia

   en.wikipedia.org/wiki/Fan-out_wafer-level_packaging

   This is known as a chip-first flow. Panel level packaging uses a large panel instead of a wafer to carry out the packaging process. [6] High end fan-out packages are those with lines and spaces narrower than 8 microns. [4] Fan-out packages can also have several dies, [5] and passive components. [6]

3. Wafer-level packaging - Wikipedia

   en.wikipedia.org/wiki/Wafer-level_packaging

   The iPhone 7 was rumored to use fan-out wafer-level packaging technology in order to achieve a thinner and lighter model. [ 2 ] [ 3 ] [ needs update ] Wafer-level chip scale packaging (WL-CSP) is the smallest package currently available on the market and is produced by OSAT (Outsourced Semiconductor Assembly and Test) companies, such as ...

4. Embedded wafer level ball grid array - Wikipedia

   en.wikipedia.org/wiki/Embedded_Wafer_Level_Ball...

   With this technology any number of additional interconnects can be realized on the package in an arbitrary distance (fan-out design). Therefore, this wafer level packaging technology can also be used for space sensitive applications, where the chip area wouldn’t be sufficient to place the required number of interconnects at a suitable distance.

5. Nvidia Accelerates AI Chip Production with New Packaging Tech ...

   www.aol.com/finance/nvidia-accelerates-ai-chip...

   Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer ...

6. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Fan-out WLCSP: Fan-out wafer-level packaging: Variation of WLCSP. Like a BGA package but with the interposer built directly atop the die and encapsulated alongside it. eWLB: Embedded wafer level ball grid array: Variation of WLCSP. MICRO SMD-Chip-size package (CSP) developed by National Semiconductor [21] COB: Chip on board: Bare die supplied ...

7. Advanced packaging (semiconductors) - Wikipedia

   en.wikipedia.org/wiki/Advanced_packaging...

   Advanced packaging includes multi-chip modules, 3D ICs, [2] 2.5D ICs, [2] heterogeneous integration, [3] fan-out wafer-level packaging, [2] system-in-package, quilt packaging, combining logic (processors) and memory in a single package, die stacking, wafer bonding/stacking, several chiplets or dies in a package, [2] combinations of these ...

8. Glossary of microelectronics manufacturing terms - Wikipedia

   en.wikipedia.org/wiki/Glossary_of...

   wafer-to-wafer (also wafer-on-wafer) stacking – bonding and integrating whole processed wafers atop one another before dicing the stack into dies; wire bonding – using tiny wires to interconnect an IC or other semiconductor device with its package (see also thermocompression bonding, flip chip, hybrid bonding, etc.) WLP – see wafer-level ...

9. Applied Materials (AMAT) Q3 2024 Earnings Call Transcript - AOL

   www.aol.com/applied-materials-amat-q3-2024...

   Image source: The Motley Fool. Applied Materials (NASDAQ: AMAT) Q3 2024 Earnings Call Aug 15, 2024, 4:30 p.m. ET. Contents: Prepared Remarks. Questions and Answers. Call Participants