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AMD Wraith is a family of downdraft type CPU coolers designed by AMD. The Wraith was introduced as a heatpipe-equipped stock cooler for certain AMD FX CPUs and AMD A-series APUs. The Wraith was introduced as a heatpipe-equipped stock cooler for certain AMD FX CPUs and AMD A-series APUs.
These three models are the Ryzen 5 7600, Ryzen 7 7700, and Ryzen 9 7900, which feature a lower TDP of 65 W, and come bundled with stock coolers, unlike the X-suffix processors. [16] [17] The Ryzen 9 7900X3D and 7950X3D processors with 3D V-Cache were released on February 28, 2023, [18] followed by the Ryzen 7 7800X3D on April 6. [19]
This line succeeds the original AMD Wraith cooler, which was released in mid-2016. [40] The Wraith Stealth is a bundled low-profile unit meant for the lower-end CPUs with a rating for a TDP of 65 W, whereas the Wraith Spire is the bundled mainstream cooler with a TDP rating of 95 W, along with optional RGB lighting on certain models.
Configurable TDP (cTDP), also known as programmable TDP or TDP power cap, is an operating mode of later generations of Intel mobile processors (as of January 2014) and AMD processors (as of June 2012) that allows adjustments in their TDP values. By modifying the processor behavior and its performance levels, power consumption of a processor can ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
AMD uses a single Promontory 21 chipset for all configurations that include a chipset. A single Promontory 21 chip provides four SATA III ports and twelve PCIe 4.0 lanes. Four lanes are reserved for the chipset uplink to the CPU while another four are used to connect to another Promontory 21 chip in a daisy-chained topology for X670, X670E and ...
AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and ...
Zen 3 with 3D V-Cache for server, codenamed Milan-X, was announced in AMD's Accelerated Data Center Premiere Keynote on November 8, 2021. It brings a 50% increase in select datacenter applications over Zen 3's Milan CPUs while maintaining socket compatibility with them. [35] Milan-X was released on March 21, 2022. [36]
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