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Rogers manufactures PORON® brand industrial microcellular polyurethane. [18] [19] PCB Duroid material. In March 2020 Rogers filed a complaint against ElastaPro for trade secret violations, claiming that this company had unlawfully obtained Rogers' technical formulations and manufacturing knowhow. [20]
FR-4 is a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant (self-extinguishing). "FR" stands for "flame retardant", and does not denote that the material complies with the standard UL94V-0 unless testing is performed to UL 94, Vertical Flame testing in Section 8 at a compliant lab. The ...
FR-2 (Flame Resistant 2) is a NEMA designation for synthetic resin bonded paper, a composite material made of paper impregnated with a plasticized phenol formaldehyde resin, used in the manufacture of printed circuit boards. Its main properties are similar to NEMA grade XXXP (MIL-P-3115) material, and can be substituted for the latter in many ...
Phenolic paper is a material often used to make printed circuit board (PCB) substrates (the flat board to which electronic components and traces are attached). It is a very tough board made of wood fibre and phenolic polymers. It is most commonly brown in colour, and is a fibre reinforced plastic.
DataSheets.com is a searchable database of electronic component data sheets and purchasing information. [1] The website is intended for Design engineers and Electronics purchasing agents. [ 2 ] DataSheets.com was developed by UBM in conjunction with SiliconExpert Technologies .
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components.. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation (up to several thousand vo
Perfboard is a material for prototyping electronic circuits. It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of 0.1 inches (2.54 mm) spacing. These holes are ringed by round or square copper pads, though bare boards are also available.
The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, [2] when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. [3]