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It relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions (30 °C/85%RH at Level 1; 30 °C/60%RH at all other levels). Increasingly, semiconductors have been manufactured in smaller sizes.
Conformal coatings are used to protect electronic components from possible environmental exposure; they allow moisture to escape but protect against contamination. More recently, conformal coatings are being used to reduce the formation of whiskers [ 2 ] and to prevent current bleed between closely positioned components.
Humidity plays an important role for surface life. For animal life dependent on perspiration (sweating) to regulate internal body temperature, high humidity impairs heat exchange efficiency by reducing the rate of moisture evaporation from skin surfaces. This effect can be calculated using a heat index table, or alternatively using a similar ...
Reliability of a semiconductor device is the ability of the device to perform its intended function during the life of the device in the field.. There are multiple considerations that need to be accounted for when developing reliable semiconductor devices:
Humidity indicator cards are also present on many small electronic devices, ranging from cellular phones to laptop computers, for the purpose of alerting the manufacturer that the device has been exposed to high levels of moisture. In many cases this voids or changes the terms of warranty coverage for the device. [2]
IEC 60068 is an international standard for the environmental testing of electrotechnical products that is published by the International Electrotechnical Commission (IEC).. IEC 60068 is a collection of methods [1] for environmental testing of electronic equipment and products to assess their ability to perform under environmental conditions including extreme cold and dry heat.
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause ...
where E a is the activation energy for the temperature-induced failure (most often 0.7 eV for electronics), k is the Boltzmann constant, T o is the operating temperature in kelvins, and T s is the stressed temperature. Therefore the total acceleration factor for unbiased HAST testing is
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