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Congener descriptors give a shorthand notation for geometry and substituent positions. The twelve congeners that display all four of the descriptors are referred to as being "dioxin-like", referring both to their toxicity and structural features which make them similar to 2,3,7,8-tetrachlorodibenzo-p-dioxin (2378-TCDD). [1]
The coplanar group members have a fairly rigid structure, with their two phenyl rings in the same plane. It renders their structure similar to polychlorinated dibenzo- p -dioxins (PCDDs) and polychlorinated dibenzofurans , and allows them to act like PCDDs, as an agonist of the aryl hydrocarbon receptor (AhR) in organisms.
Figure 1. A microstrip line shielded by via fences on a printed circuit board. A via fence, also called a picket fence, is a structure used in planar electronic circuit technologies to improve isolation between components which would otherwise be coupled by electromagnetic fields.
Fig.1: Wineglass model for IMRaD structure. The above scheme shows how to line up the information in IMRaD writing. It has two characteristics: the first is its top-bottom symmetric shape; the second is its change of width, meaning the top is wide, and it narrows towards the middle, and then widens again as it goes down toward the bottom.
An outline, also called a hierarchical outline, is a list arranged to show hierarchical relationships and is a type of tree structure. An outline is used [1] to present the main points (in sentences) or topics of a given subject. Each item in an outline may be divided into additional sub-items.
Small-outline integrated circuit. This package has 16 "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches. Early integrated circuits were packaged in ceramic flat packs, which the military used for many years for their reliability and small size. The other type of packaging used in the 1970s, called the ICP ...
Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.
A pictorial essay is a series of high-quality images published for teaching purposes. A review is a detailed analysis of recent developments on a topic. A commentary is a short summary of an author's personal experience. Editorials are short reviews or critiques of original articles.