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  2. Wafer (electronics) - Wikipedia

    en.wikipedia.org/wiki/Wafer_(electronics)

    In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon

  3. Wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Wafer-level_packaging

    A wafer-level package attached to a printed-circuit board. Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are ...

  4. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    [55] [56] The semiconductor industry has adopted larger wafers to cope with the increased demand for chips as larger wafers provide more surface area per wafer. [57] Over time, the industry shifted to 300 mm wafers which brought along the adoption of FOUPs, [ 58 ] but many products that are not advanced are still produced in 200 mm wafers such ...

  5. Wafer fabrication - Wikipedia

    en.wikipedia.org/wiki/Wafer_fabrication

    Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...

  6. Wafering - Wikipedia

    en.wikipedia.org/wiki/Wafering

    Wafering is the process by which a silicon crystal is made into wafers. This process is usually carried out by a multi-wire saw which cuts multiple wafers from the same crystal at the same time. These wafers are then polished to the desired degree of flatness and thickness.

  7. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.

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    The search engine that helps you find exactly what you're looking for. Find the most relevant information, video, images, and answers from all across the Web.

  9. Wafer - Wikipedia

    en.wikipedia.org/wiki/Wafer

    A wafer is a crisp, often sweet, very thin, flat, light biscuit, [1] often used to decorate ice cream, and also used as a garnish on some sweet dishes. [2] They frequently have a waffle surface pattern but may also be patterned with insignia of the food's manufacturer or may be patternless.