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In business and for engineering economics in both industrial engineering and civil engineering practice, the minimum acceptable rate of return, often abbreviated MARR, or hurdle rate is the minimum rate of return on a project a manager or company is willing to accept before starting a project, given its risk and the opportunity cost of forgoing other projects. [1]
Solder mask, solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads.
Some key QFN design considerations are pad and stencil design. When it comes to bond pad design two approaches can be taken: solder mask defined (SMD) or non-solder mask defined (NSMD). A NSMD approach typically leads to more reliable joints, since the solder is able to bond to both the top and sides of the copper pad. [4]
In statistics, ordinary least squares (OLS) is a type of linear least squares method for choosing the unknown parameters in a linear regression model (with fixed level-one [clarification needed] effects of a linear function of a set of explanatory variables) by the principle of least squares: minimizing the sum of the squares of the differences between the observed dependent variable (values ...
The mask must be centered correctly. The mask protects the PWB against oxidation, and prevents unintended solder bridges from forming between closely spaced solder pads. Also the height of the solder mask should be lower than the pad height to avoid gasketing problems. If the height of the solder mask is greater than that of the pad, then some ...
The most basic design rules are shown in the diagram on the right. The first are single layer rules. A width rule specifies the minimum width of any shape in the design. A spacing rule specifies the minimum distance between two adjacent objects. These rules will exist for each layer of semiconductor manufacturing process, with the lowest layers ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Under the standard assumption of neoclassical economics that goods and services are continuously divisible, the marginal rates of substitution will be the same regardless of the direction of exchange, and will correspond to the slope of an indifference curve (more precisely, to the slope multiplied by −1) passing through the consumption bundle in question, at that point: mathematically, it ...