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A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
White sands test sample, owned by Thermashield, LLC. Starlite is an intumescent material said to be able to withstand and insulate from extreme heat. It was invented by British hairdresser and amateur chemist Maurice Ward (1933–2011) during the 1970s and 1980s, and received significant publicity after coverage of the material aired in 1990 on the BBC science and technology show Tomorrow's ...
Improved thermal insulation (for pipelines, aerospace, etc.), as well as insulative "glass" if it can be made clear Amorphous metal: Experiments, use in amorphous metal transformers: Armor, implants Bioplastic: Limited commercialization (e.g. polylactic acid in 3D printing) Disposable packaging and single-use items Conductive polymers
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VentureStar would have used a new metallic thermal protection system, safer and cheaper to maintain than the ceramic protection system used on the Space Shuttle. VentureStar's metallic heat shield would have eliminated 17,000 between-flight maintenance hours typically required to satisfactorily check (and replace if needed) the thousands of ...
Thermal insulation is the reduction of heat transfer (i.e., the transfer of thermal energy between objects of differing temperature) between objects in thermal contact or in range of radiative influence. [1] Thermal insulation can be achieved with specially engineered methods or processes, as well as with suitable object shapes and materials.
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Measurements of thermal conductivity are also subject to contact resistance, with particular significance in heat transport through granular media. Similarly, a drop in hydrostatic pressure (analogous to electrical voltage ) occurs when fluid flow transitions from one channel to another.