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  2. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...

  3. List of thermal conductivities - Wikipedia

    en.wikipedia.org/wiki/List_of_thermal_conductivities

    Very high thermal conductivity measurements up to 22,600 w m −1 K −1 were reported by Fenton, E.W., Rogers, J.S. and Woods, S.D. in reference 570 on page 1458, 41, 2026–33, 1963. The data is listed on pages 6 through 8 and graphed on page 1 where Fenton and company are on curves 63 and 64.

  4. Beryllium oxide - Wikipedia

    en.wikipedia.org/wiki/Beryllium_oxide

    This colourless solid is an electrical insulator with a higher thermal conductivity than any other non-metal except diamond, and exceeds that of most metals. [12] As an amorphous solid, beryllium oxide is white. Its high melting point leads to its use as a refractory material. [13] It occurs in nature as the mineral bromellite.

  5. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  6. Thermal conductivity and resistivity - Wikipedia

    en.wikipedia.org/wiki/Thermal_conductivity_and...

    The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.

  7. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics. [2] Sn 40 Pb 42 Cd 18: 145: Cd, Pb: Low melting temperature allows repairing pewter and zinc objects, including die-cast toys. Sn 50 Pb 32 Cd 18: 145 [16] Cd, Pb: Cd18: Cd 82.5 Zn 17.5: 265 [27] Cd: Yes

  8. Aluminium nitride - Wikipedia

    en.wikipedia.org/wiki/Aluminium_nitride

    AlN has high thermal conductivity, high-quality MOCVD-grown AlN single crystal has an intrinsic thermal conductivity of 321 W/(m·K), consistent with a first-principle calculation. [5] For an electrically insulating ceramic, it is 70–210 W/(m·K) for polycrystalline material, and as high as 285 W/(m·K) for single crystals). [11]

  9. Boron nitride - Wikipedia

    en.wikipedia.org/wiki/Boron_nitride

    Because of its excellent thermal and chemical stability, boron nitride ceramics and coatings are used high-temperature equipment. h-BN can be included in ceramics, alloys, resins, plastics, rubbers, and other materials, giving them self-lubricating properties. Such materials are suitable for construction of e.g. bearings and in steelmaking. [20]

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