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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
Carl Zeiss SMT GmbH comprises the Semiconductor Manufacturing Technology business group of ZEISS and develops and produces equipment for the manufacture of microchips. The company is majority owned by Carl Zeiss AG, with a 24.9% minority stake by ASML Holding .
Universal Instruments Corporation is an electronics technology company located in Conklin, New York. [1] Universal Instruments builds automated machines that enable electronics manufacturing services companies to construct surface-mount technology and through-hole technology circuits, such as SMT placement equipment, insertion mount machines, and machines for electronic packaging. [2]
Jabil Inc. is an American multinational manufacturing company involved in the design, engineering, and manufacturing of electronic circuit board assemblies and systems, along with supply chain services, primarily serving original equipment manufacturers. [5] [6] It is headquartered in the Gateway area of St. Petersburg, Florida.
Nordson Corporation is an American multinational corporation that designs and manufactures dispensing equipment for consumer and industrial adhesives, sealants and coatings. The company also manufactures equipment used in the testing and inspection of electronic components, technology-based systems for curing and surface treatment processes as ...
Electronics manufacturing services (EMS) is a term used for companies that design, manufacture, test, distribute, and provide return/repair services for electronic components and assemblies for original equipment manufacturers (OEMs). The concept is also referred to as electronics contract manufacturing (ECM). [1]
An IC equipment supplier's revenue is classified as sales of systems used to manufacture semiconductors, thin-film heads, MEMS, and integrated circuits, as well as service, support, and retrofitted systems (flat panel displays are not included).
In 1981, it launched a conversion kit that enabled manual aluminum wire bonder to operate semi-automatically. By 1984, it launched its fully-automatic wire bonders. In 1985, ASMPT produced its first die bonder aimed at LED manufacturers. By the end of the 1980s, the sales of leadframes and equipment provided steady profit streams for ASMPT. [2]
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