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  2. Pick-and-place machine - Wikipedia

    en.wikipedia.org/wiki/Pick-and-place_machine

    They are used for high speed, high precision placing of a broad range of electronic components (such as capacitors, resistors, and integrated circuits) onto the PCBs which are in turn used in computers, consumer electronics, and industrial, medical, automotive, military and telecommunications equipment.

  3. Reflow oven - Wikipedia

    en.wikipedia.org/wiki/Reflow_oven

    A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs). In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel. For prototyping or hobbyist use PCBs can be placed in a small oven with a door.

  4. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Alternatively, SMT and through-hole components can be soldered on the same side of a board without adhesive if the SMT parts are first reflow-soldered, then a selective solder mask is used to prevent the solder holding those parts in place from reflowing and the parts floating away during wave soldering. Surface mounting lends itself well to a ...

  5. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    TO-262: [24] Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting; TO-263: [24] Also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole; TO-274: [24] Also called Super-247: SMT package similar to the TO-247 without the mounting hole

  6. Selective soldering - Wikipedia

    en.wikipedia.org/wiki/Selective_soldering

    Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes. This usually follows an SMT oven reflow process; parts to be ...

  7. SMT placement equipment - Wikipedia

    en.wikipedia.org/?title=SMT_placement_equipment&...

    Language links are at the top of the page. Search. Search

  8. Depaneling - Wikipedia

    en.wikipedia.org/wiki/Depaneling

    Four-PCB panel. Depaneling or depanelization is a process step in high-volume electronics assembly production. In order to increase the throughput of printed circuit board (PCB) manufacturing and surface mount (SMT) lines, PCBs are often arranged in a process called panelization so that they consist of many smaller individual PCBs that will be used in the final product.

  9. IPC (electronics) - Wikipedia

    en.wikipedia.org/wiki/IPC_(electronics)

    IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.

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