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  2. Dicing saw - Wikipedia

    en.wikipedia.org/wiki/Dicing_saw

    Diamond wire saw in stone industry. A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire [1] to dice, cut, or groove semiconductor wafers, and glass, ceramic, crystal, and many other types of material.

  3. Disco Corporation - Wikipedia

    en.wikipedia.org/wiki/Disco_Corporation

    DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage ...

  4. Die singulation - Wikipedia

    en.wikipedia.org/wiki/Die_singulation

    Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw ) [ 2 ] or laser cutting .

  5. US to award Taiwan's GlobalWafers up to $400 million to ... - AOL

    www.aol.com/news/us-award-taiwans-globalwafers...

    The wafers are a crucial component of advanced semiconductors and part of the US to award Taiwan's GlobalWafers up to $400 million to boost US semiconductor wafer production Skip to main content

  6. Wafer (electronics) - Wikipedia

    en.wikipedia.org/wiki/Wafer_(electronics)

    In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon

  7. ASM International - Wikipedia

    en.wikipedia.org/wiki/ASM_International

    The company was founded by Arthur del Prado (1931-2016) as 'Advanced Semiconductor Materials' in 1964. [2] From 2008 until 2020, son of Arthur del Prado, Chuck del Prado was CEO . ASM pioneered important aspects of many established wafer-processing technologies used in industry, including lithography , deposition , ion implantation , single ...

  8. Intel CEO calls TSMC an 'awesome' company, says the company ...

    www.aol.com/finance/intel-ceo-calls-tsmc-awesome...

    Intel CEO Pat Gelsinger weighs in on the company's relationship with TSMC, the status of CHIPS Act funding and the outlook for the business. ... a sample of a wafer during his keynote speech at ...

  9. List of semiconductor fabrication plants - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    This is a list of semiconductor fabrication plants, factories where integrated circuits (ICs), also known as microchips, are manufactured.They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from fabless companies and do ...

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