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  2. Physical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Physical_vapor_deposition

    PVD process flow diagram. Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from ...

  3. Sputter deposition - Wikipedia

    en.wikipedia.org/wiki/Sputter_deposition

    Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. [1] [2]

  4. Water flow test - Wikipedia

    en.wikipedia.org/wiki/Water_flow_test

    A process to perform a water flow test is explained in the model fire codes as published by NFPA (National Fire Protection Association). If a water supply source is considered weak compared to what is required by the sprinkler system design hydraulic calculation , the water pressure can be boosted by means of a fire pump .

  5. Deposition (phase transition) - Wikipedia

    en.wikipedia.org/wiki/Deposition_(phase_transition)

    For deposition to occur, thermal energy must be removed from a gas. When the air becomes cold enough, water vapour in the air surrounding a leaf loses enough thermal energy to change into a solid. Even though the air temperature may be below the dew point, the water vapour in the air alone may not condense spontaneously. This supercooled water ...

  6. Atomic layer deposition - Wikipedia

    en.wikipedia.org/wiki/Atomic_layer_deposition

    There, the starting surface contains hydroxyls (OH groups) as reactive sites; Step 1 is the reaction of TMA; Step 2 is a purge or evacuation step, Step 3 is the reaction of water, and Step 4 is a purge or evacuation step. [1] Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical ...

  7. Moisture vapor transmission rate - Wikipedia

    en.wikipedia.org/wiki/Moisture_vapor...

    ASTM F1249 - Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor; ASTM F2298- Standard Test Methods for Water Vapor Diffusion Resistance and Air Flow Resistance of Clothing Materials Using the Dynamic Moisture Permeation Cell

  8. Flash evaporation - Wikipedia

    en.wikipedia.org/wiki/Flash_evaporation

    Here, the words "upstream" and "downstream" refer to before and after the liquid passes through the throttling valve or device. This type of flash evaporation is used in the desalination of brackish water or ocean water by "Multi-Stage Flash Distillation." The water is heated and then routed into a reduced-pressure flash evaporation "stage ...

  9. Vapor-compression evaporation - Wikipedia

    en.wikipedia.org/wiki/Vapor-compression_evaporation

    The compression ratio in a MVR unit does not usually exceed 1.8. At a compression ratio of 1.8, if the evaporation is performed at atmospheric pressure (0.101 MPa), the condensation pressure after compression will be 0.101 x 1.8 = 0.1818 [MPa]. At this pressure, the condensation temperature of the water vapor at the heat exchanger will be 390 K.