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A chip scale atomic clock (CSAC) is a compact, low-power atomic clock fabricated using techniques of microelectromechanical systems (MEMS) and incorporating a low-power semiconductor laser as the light source. The first CSAC physics package was demonstrated at the National Institute of Standards and Technology in 2003, [1] based on an invention ...
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Oxide thickness [1] MOSFET logic Researcher(s) Organization Ref; June 1960: 20,000 nm: 100 nm: PMOS: Mohamed M. Atalla, Dawon Kahng: Bell Telephone Laboratories [2] [3] NMOS: 10,000 nm: 100 nm: PMOS Mohamed M. Atalla, Dawon Kahng: Bell Telephone Laboratories [4] NMOS May 1965: 8,000 nm 150 nm: NMOS Chih-Tang Sah, Otto Leistiko, A.S. Grove ...
Products included hydrogen masers, rubidium and cesium atomic standards, temperature and oven controlled crystal oscillators, miniature and chip scale atomic clocks, network time servers, network sync management systems, cable timekeeping solutions, telecom synchronization supply units (SSUs), and timing test sets.
In addition to increased accuracy, the development of chip-scale atomic clocks has expanded the number of places atomic clocks can be used. In August 2004, NIST scientists demonstrated a chip-scale atomic clock that was 100 times smaller than an ordinary atomic clock and had a much smaller power consumption of 125 mW.
In semiconductor manufacturing, the 2 nm process is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node.. The term "2 nanometer", or alternatively "20 angstrom" (a term used by Intel), has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors.
Cutler worked at Hewlett-Packard Laboratories (1957–1999), where he developed oscillators, atomic frequency standards and designed atomic chronometers. In 1999, he went on to work at Agilent Technologies, a spin-off from H-P, where he developed quartz oscillators, atomic clocks, and used the Global Positioning System to synchronize clocks worldwide. [3]
According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.